| 持股明細(資料日期：2026/05/31) |
| 持股名稱 | 比例 |
| Barings Global High Yield Bond Fund | 5.60% |
| United States Treasury FRN Bond due January 2027 | 5.30% |
| United States Treasury 3.5% Bond Due February 2039 | 5.10% |
| Taiwan Semiconductor Manufacturing Co Ltd | 4.90% |
| Spain Kingdom Of 5.75% Senior Unsecured Bond Due July 2032 | 3.80% |
| United States Treasury 4.25% Bond due May 2035 | 3.20% |
| Italy Republic Of 4.4% Senior Unsecured Bond Due May 2033 | 3.20% |
| Samsung Electronics Co Ltd | 3.00% |
| Germany Federal Republic Of 4.75% Senior Unsecured Bond Due July 2034 | 3.00% |
| United States Treasury 4.625% Bond due February 2055 | 2.50% |